TS2 Micro

TS2 Micro has developed Europe's widest range of semiconductor die packaging capabilities and techniques. This allows us to handle practically any electronic interconnection requirement, in low volume for prototyping to high volume for mass production. Typical applications include medical, wearable electronics, RF applications, RFID and lighting.

Semiconductor die are generally placed on laminate or flex substrates but ceramic and metal can packaging is available for specialist applications. TS2 Micro has many years' experience in design and manufacture of high density, multi die modules using chip on board technology. Single die may be packaged in application specific carriers or supplied in standard plastic encapsulated packages as required.

In general, TS2 Micro utilizes its extensive design and engineering expertise to manufacture product in the UK. Sub contract manufacture to customer specification is also available. Extensive electrical test facilities are available to provide a full 'Turnkey' solution from design through to final product test if required.